● 2010:

– system development for laser direct imaging with submicron accuracy

– process development for new wafer scale processing on microoptics and MEMS

– system development for laser drilling and milling with micron accuracy

– base module development for Manufacturing Execution System (MES)

● 2009:

– development of torqueangle measurement cell

– feasibility study for component placing with submicron accuracy

– feasibility study for laser direct imaging with submicron accuracy

– system development for wafer separation

– system development for wafer placing with micron accuracy

– wafer cleansing system for dust and particle remove

● 2007:

 – feasibility study for optical characterisation of MID

– system development for membran thickness measurements with micron accuracy

– system development for optical wafer characterisation

● 2006:

– system development for electrical characterisation of MID

–increase system measurement capability up to 1000V